HDMI 2.1 CABLE - 5M

The ROG Strix X670E-F Gaming WiFi is the stealthy alter ego of the Strix X670E-A. A substantial power buff relays its inner demon, giving exclusive ROG overclocking utilities even more headroom to unleash the potential of AMD Ryzen™ 7000 Series processors. And its black PCB and dark metallic heatsinks aesthetically match a wider variety of system hardware and build themes, while a dash of customizable color on its shroud subtly announces an ROG presence in your AM5 build.

• Supports AMD Ryzen™ 9000 / 8000 / 7000 Series Desktop Processors
• Supports DDR5 Memory, Dual Channel DDR5 7800+MHz (OC)
• Enhanced Power Design: 18+2+1 Duet Rail Power System, Dual 8-pin CPU power connectors, Core Boost, Memory Boost
• Premium Thermal Solution: Extended Heatsink with Direct Touched Heat-pipe, MOSFET thermal pads rated for 7W/mK, additional choke thermal pads and Double-sided M.2 Shield Frozr are built for high performance system and non-stop gaming experience
• High Quality PCB: 8-layer PCB made by 2oz thickened copper and server grade level material
• DIY Friendly Design: Patented Screwless M.2 Shield Frozr, EZ M.2 Clips, Smart Button, Pre-installed I/O Shield, Steel Armor
• Lightning Fast Game experience: PCIe 5.0 slots, Lightning Gen 5 x4 M.2, USB 3.2 Gen 2x2
• 2.5G LAN and Wi-Fi 6E Solution: Upgraded network solution for professional and multimedia use. Delivers a secure, stable and fast network connection
• MYSTIC LIGHT: 16.8 million colors / fancy lighting effects controlled in one click. MYSTIC LIGHT SYNC supports latest ARGB Gen2 strips, RGB strips and Ambient devices
• AUDIO BOOST 5: Reward your ears with studio grade sound quality for the most immersive gaming experience

The DeepCool EK720 High Performance Thermal Pad is the perfect interface for fast heat transfer on integrated circuit chips that need performance, compatibility, and ease-of-use.

The DeepCool EK720 High Performance Thermal Pad is the perfect interface for fast heat transfer on integrated circuit chips that need performance, compatibility, and ease-of-use.